Wafer- and die-level surface and edge optical testing are easily accomplished using our optical test solutions. Using direct-drive axes, our positioning solutions achieve high-throughput and high-precision over long travels without the need for fine and coarse mechanical positioning axes.

• Nanopositioning probe aligners with minimum incremental motion down to 0.5 nm
• Wafer positioning stages with rotary and vertical alignment axes for the greatest flexibility
• Component, subsystem and system solutions are available for your process development and integration
• Easily integrate optical power measurements
• Simple coordination with other motion axes that carry electrical probes, microscopes and other test equipment